Samsung Begins Shipping Advanced HBM4 Chips to Customers Amid AI Data Center Boom

SEOUL, Feb 12 (GeokHub) — Samsung Electronics has started shipping its latest HBM4 memory chips to select customers, signaling an intensified push to compete in the high-performance memory market critical for AI data center accelerators.

The surge in global AI infrastructure demand has fueled need for high-bandwidth memory that can efficiently feed massive data workloads to AI training and inference systems. Samsung’s new HBM4 chips aim to address this growing market, which is increasingly dominated by rivals such as SK Hynix and Micron.

HBM4 Performance and Features

Samsung’s HBM4 memory achieves a consistent processing speed of 11.7 gigabits per second (Gbps), marking a 22% improvement over the previous HBM3E generation. The chips are capable of reaching peak speeds of 13 Gbps, helping to reduce data bottlenecks in next-generation AI systems.

Customer feedback on the HBM4 chips has reportedly been “very satisfactory,” according to Song Jai-hyuk, Chief Technology Officer for Samsung Electronics’ chip division. Samsung also announced plans to deliver samples of next-generation HBM4E chips later this year, further signaling its commitment to competing in the advanced memory sector.