SEOUL | Jan 26 (GeokHub) Samsung Electronics is preparing to begin production of its next-generation high-bandwidth memory chips, known as HBM4, as early as next month, according to a person familiar with the matter. The chips are expected to be supplied to U.S. artificial intelligence leader Nvidia, marking a key step in Samsung’s push to regain ground in the competitive AI memory market.
The move comes as Samsung works to close the gap with domestic rival SK Hynix, which has emerged as the dominant supplier of advanced memory chips used in Nvidia’s AI accelerators. Supply setbacks last year weighed on Samsung’s earnings and share performance, intensifying pressure on the company to accelerate its next-generation roadmap.
Samsung shares rose more than 2% in early trading following the report, while shares of SK Hynix declined nearly 3%.
HBM4 Qualification and Market Competition
Industry sources say Samsung has recently passed qualification tests for HBM4 chips for both Nvidia and AMD, clearing the way for initial shipments to begin as soon as February. The company declined to comment on production volumes or customer specifics, while Nvidia did not immediately respond to requests for comment.
HBM4 chips are expected to play a critical role in Nvidia’s upcoming AI platforms, including the Vera Rubin architecture, which Nvidia Chief Executive Jensen Huang has said is already in full production ahead of a broader launch later this year.
Rivalry with SK Hynix Intensifies
SK Hynix, currently the primary supplier of high-bandwidth memory to Nvidia, said in October it had completed supply negotiations with major customers for 2026. The company also plans to begin deploying silicon wafers next month at its new M15X fabrication plant in Cheongju, South Korea, though it has not confirmed whether HBM4 will be part of the initial output.
Both Samsung and SK Hynix are scheduled to report fourth-quarter earnings later this week, when investors expect further clarity on HBM4 orders and production timelines.
